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High Volume: iS6059 PCB Inspection
Inspección eficiente iS6059 PCB Inspection La inspección iS6059 PCB Inspection combina la detección precisa de errores con una alta velocidad de inspección para la producción de series grandes. Más ventajas: programación rápida, manejo intuitivo e integración de la Industrias 4.0. Tecnología de sensores: XMs-II / XM8-II 1 cámara ort. y 8 cámeras inclinadas Resolución: 10 µm/pixel / 8 µm/pixel FOV: 50 mm x 50 mm / 40 mm x 40 mm Para: control de equipamiento, inspección de componentes, inspección de…
Top- and Bottom-Side: iS6059 Double-Sided Inspection
Innovative iS6059 Double-Sided Inspection Highly effective inspection of PCB top and bottom sides to provide the most accurate inspection of components, solder joints and pin lengths using the most advanced 3D camera technology. 1 orth. and 8 angled cameras from above 1 orth. and 8 angled cameras from below Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection
Bottom-side: iS6059 THT Inspection
Advanced iS6059 THT Inspection Specifically designed for rapid inspection of PCB undersides to provide the most accurate inspection of THT solder joints and pin lengths using the most advanced 3D camera technology. Extra plus: flexible handling of workpiece carriers. 1 orth and 8 angled cameras Resolution: 13 µm/pixel FOV: 50 x 50 mm For: assembly inspection, component control, solder joint inspection