Power Electronics Industry
Advanced X-ray Inspection for Power Electronics
The power electronics industry is under constant pressure to deliver higher performance, greater reliability, and shorter development cycles. As power densities increase and applications in e-mobility, renewable energy, and industrial automation expand, product quality becomes a decisive competitive factor. Critical characteristics such as void rates beneath the DIE in IGBT modules, the integrity of bonding wires in power semiconductors, and the reliable connection of heat sinks directly influence efficiency, lifetime, and system safety.
As a global provider of inspection solutions, Viscom understands the specific challenges of power electronics manufacturing. With decades of experience in automated inspection and production quality assurance, Viscom supports manufacturers in maintaining transparency across complex production processes and safeguarding the quality of critical power modules and semiconductor assemblies. The result is greater process stability, reliable quality data, and improved production efficiency. Key factors for companies aiming to strengthen their competitive position in a rapidly evolving power electronics market.
Why choose Viscom?
We make technology safe, reliable and sustainable!
40 Years of Expertise
Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.
100% Defect Detection
Always advancing with the latest inspection solutions to achieve the highest detection rates and support zero-defect manufacturing.
Award-Winning Inspection Solutions
Industry-leading inspection systems recognized worldwide for outstanding performance, precision, and reliability across every production stage.
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FIND THE RIGHT INSPECTION SOLUTION FOR YOUR Manufacturing process
Benefit from Viscom's award-winning inspection technologies and our global support from experts.
Applications
Wire Bond Inspection
As Wire Bonding moves toward thinner wires, finer pitches, and high-power applications, defect-free inspection becomes essential, especially in automotive and 5G Electronics.
Void Inspection
Voids can develop within applications when air, gas, moisture, or contaminants become trapped during the application, dispensing, curing, or manufacturing process.
Solder Paste Inspection
Solder Paste Inspection (SPI) is a critical process in SMT manufacturing, ensuring precise solder paste deposition on printed circuit boards before component placement.