Post-Reflow Inspection

Post Reflow Inspection

Inspection systems by Viscom inspect solder joints and assembly quality after the reflow process. Precise detection of solder defects, bridges, voids, and misalignment ensures reliable PCB (Printed Circuit Board) manufacturing.

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Post-Reflow Inspection

Advanced Inspection Solutions for SMT Manufacturing

Post-Reflow Inspection takes place after soldering and focuses on the quality of solder joints, component placement, and final PCB (Printed Circuit Board) assembly. Viscom’s advanced 3D inspection systems use high-resolution imaging and precise 3D measurement to inspect solder joints and components. Typical defects such as insufficient solder, solder bridges, lifted or misaligned components, missing components, and polarity errors can be detected quickly and reliably.

For hidden solder joints that cannot be inspected optically, AXI (Automated X-ray Inspection) complements AOI (Automated Optical Inspection) by providing detailed insight beneath components such as BGAs, QFNs, and LGAs. X-ray inspection enables reliable detection of voids or other hidden solder joint defects. Combining 3D AOI and AXI provides comprehensive post-reflow quality control, helping manufacturers improve first-pass yield, reduce rework, optimize SMT processes, and ensure reliable PCB assemblies. 

Why choose Viscom?

We make technology safe, reliable and sustainable!

40 Years of Expertise

Four decades of inspection know-how, combining deep industry knowledge with proven innovation to deliver trusted inspection solutions.

100% Defect Detection

Always advancing with the latest inspection solutions to achieve the highest detection rates and support zero-defect manufacturing.

Award-Winning Inspection Solutions

Industry-leading inspection systems recognized worldwide for outstanding performance, precision, and reliability across every production stage.

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FIND THE RIGHT INSPECTION SOLUTION FOR YOUR Manufacturing process

Benefit from Viscom's award-winning inspection technologies and our global support from experts.

Products

iS6059 THT Inspection

With innovative 3D camera technology, the iS6059 THT Inspection 3D AOI system inspects THT components, THT solder joints, press-fit and SMD components shadow-free and at high precision on the underside of the PCB.

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iS6059 PCB Inspection

The iS6059 PCB Inspection combines the advantages of special high-speed 3D camera technology with excellent inspection quality and extremely fast inspection speed.

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iS6059 Dual Lane Variants

The iS6059 Dual Lane Variants Inspection combines the advantages of special high-speed 3D sensor technology with excellent inspection quality and extremely fast inspection speed.

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Product Overview