1. Viscom
  2. Solutions
  3. Product overview
  4. Automated optical inspection (AOI)

iS6059 Serie

One Series – Endless Possibilities

The Viscom iS6059 Series delivers advanced inspection solutions for modern electronics production, combining speed, precision, and flexibility across a wide range of applications. The series includes powerful AOI, SPI, and THT inspection systems designed to support reliable quality assurance throughout the entire manufacturing process. With intelligent automation high-performance imaging technology, and seamless integration into smart factory environments, the iS6059 Series helps manufacturers improve efficiency and maintain consistently high product quality. Flexible configuration options allow the systems to adapt to changing production requirements and complex electronic assemblies.

iS6052 Serie

One Series – Cost-efficient Possibilities

The Viscom iS6052 Series combines high-quality inspection performance with cost-efficient solutions for modern electronics manufacturing environments. The series includes advanced AOI, SPI, THT, and CCI inspection systems designed to deliver reliable defect detection and consistent process control across a wide range of production applications. Flexible, scalable, and easy to integrate, the iS6052 Series is an ideal solution for companies seeking dependable inspection technology with excellent value for smaller and growing production operations.

 

 

Viscom’s 3D AOI Systems for Electronics Manufacturing 

3D AOI is essential for ensuring quality and reliability in modern electronics manufacturing. Viscom provides advanced 3D AOI systems with high measurement accuracy, excellent image quality, and flexible integration into high-volume production lines. 

Using 3D grid technology, angled cameras (up to eight), and strip projection, these systems enable precise component detection and solder joint inspection, even in miniaturized assemblies with reflective or hidden features. 

The innovative 360View function delivers realistic 3D images from multiple angles, improving defect detection and classification.

Find out more about the applications of AOI

 

Solder Paste Inspection (SPI) is a critical process in SMT manufacturing, ensuring precise solder paste deposition on printed circuit boards before component placement. Advanced SPI systems use 3D measurement technology to analyze solder paste volume, detect misalignment (offset), and identify defects such as bridging between pads. Accurate volume measurement guarantees consistent solder joints, while early detection of placement deviations helps prevent costly rework and improves overall production yield. 

Modern Solder Paste Inspection solutions provide real-time process control and high-resolution analysis, making them essential for high-reliability electronics production. By detecting issues like insufficient or excessive paste, alignment errors, and solder bridges at an early stage, Viscom’s SPI systems enhance product quality and reduce defect rates. These capabilities are especially valuable in industries such as automotive, aerospace, and consumer electronics, where precision and reliability are key competitive factors. 

 

Learn more

THT Inspection is a critical application in modern electronics manufacturing, ensuring the quality and reliability of through-hole technology assemblies on the underside of printed circuit boards. As THT components, solder joints, press-fit connections, and mixed technology assemblies become increasingly complex, advanced 3D AOI Inspection for THT is essential to detect hidden defects with absolute accuracy. By leveraging innovative camera technology, THT inspection enables shadow-free analysis of challenging geometries, delivering precise detection of insufficient solder, misalignment, and structural defects. This application plays a key role in achieving consistent PCB quality control, defect prevention, and process optimization across high-reliability industries.

With the ability to combine 2D, 2.5D, and full 3D inspection, THT inspection applications provide manufacturers with a powerful tool to maintain high throughput without compromising quality. Flexible lightening options and intelligent inspection strategies allow adaption to different board designs and materials, ensuring optimal inspection results in every production environment. As a result, THT inspection solutions from Viscom significantly enhance defect detection rates, reduce rework costs, and improve overall production efficiency, making them indispensable for companies focused on delivering high-quality electronic assemblies. 

 

Learn more

Conformal Coating ensures the long-term reliability of electronic assemblies, especially in safety-critical applications. Applied to printed circuit boards (PCBs), the protective coating shields sensitive electronics from dust, contamination, humidity, condensation and temperature fluctuations.
As PCB densities increase and components become smaller, conformal coating becomes essential. Its insulating properties allow reduced spacing between conductors while maintaining electrical reliability and improving device performance.
Maximum protection for electronic assemblies
Conformal Coating Inspection (CCI) uses automated optical inspection (AOI) to ensure consistent coating quality during electronics manufacturing. Inline inspection systems verify coating presence, uniform coverage and surface quality in real time.
Viscom’s CCI systems support a wide range of coating materials, including silicone, acrylic and hybrid coatings. Using UV illumination and advanced camera technology, coating defects such as scratches, bubbles, orange peel surfaces, excess coating or missing coating areas are detected with high precision, even in complex PCB assemblies.

 

Learn more

As Wire Bonding moves toward thinner wires, finer pitches, and high-power applications, defect-free inspection becomes essential, especially in automotive and 5G Electronics. Viscom’s 3D Wire Bond Inspection Systems detect bond wires down to 17μm with high precision. Advanced illumination and high-speed camera technology deliver detailed 3D images, reduced false calls, and reliable defect verification.

The systems support all standard bonding processes, including ball-wedge, wedge-wedge, and security bonds, across materials such as aluminum, copper, silver and gold. Inspection covers bond positions, wire paths, loop profiles, and component placement, while integrated trend analysis and automated defect detection ensure stable processes and continuous quality monitoring.

 

Learn more