iX7059 SMT Edition

High-Performance 3D X-ray Inspection for Flat Assemblies

  • Complete defect detection on dense, thick and double-sided PCBs
  • High-precision solder joint inspection for tiny components
  • Modern software for fast programming & easy verification

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  1. Viscom
  2. Solutions
  3. Product overview
  4. Automated X-ray inspection (AXI)
  5. iX7059 SMT Edition

Next-Generation Inline 3D X-ray Inspection

The new iX7059 SMT Edition sets a new benchmark for high-precision inline 3D X-ray inspection. Equipped with a 130kv X-ray tube, E6 – 3D Steering, the latest Flat Panel Detector, and vVision software, it delivers expectational image quality, reliable defect detection, and high inspection performance for modern SMT production. 

Designed for the inspection of both SMD and THT assemblies, the system accurately detects hidden defects, including voids and head-in-pillow faults, even in complex PCB designs, while 3D volume visualization at the verification station enables confident and reliable defect evaluation. Combining advanced microfocus X-ray technology with intelligent 3D imaging, the iX7059 SMT Edition ensures maximum quality assurance while maintaining excellent throughput. 

Automated inspection routines, intuitive software, and AI-powered solutions minimize operator effort while maintaining consistent inspection quality across shifts and varying production volumes. AI capabilities include automated defect detection, such as void detection, AI-assisted evaluation at the verification station, and AI-supported programming. 

As part of our streamlined product portfolio, the new standard AXI configuration also enables shorter delivery times, providing greater efficiency, and faster availability without compromising performance. To further enhance productivity, the optional running stopper feature reduces cycle times, enabling even higher throughput in demanding production environments. 

THT solder joint, good/poor, insufficient degree of filling

Comparison of 2D AXI and 3D AXI slice images of different LEDs

Head in pillow defect

Poor QFN, insufficient solder volume

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The iX7059 Product Family

With the iX7059 product family from Viscom you have 100% quality control in the process line – even with increasing requirements. The innovative and intelligently networked 3D AXI systems enable fast, fully automated inline X-ray inspection of e.g. complex and very large PCBs or heavy, large and enclosed assemblies and solid inspection objects on workpiece carriers.

  • 100% quality assurance
  • Handles up to 200 kg and 2 meters in length
  • Future-ready inline X-ray
  • Fast inspection of heavy electronics
  • Space-saving system design
  • Also ideal for the final assembly line
  • Rapid delivery times

Inspection Images from Viscom’s AXI Systems

Explore a selection of inspection images captured with Viscom’s 3D AXI technology. The gallery demonstrates high-resolution X-ray imaging, reliable defect detection, and precise analysis of hidden solder joints and internal structures. These examples show how advanced AXI inspection supports quality assurance in modern electronics manufacturing, even for complex and densely populated assemblies.

Technical Specifications

X-ray technology


iX7059 SMT Edition
X-ray tubeSealed microfocus X-ray tube
High voltage130 kV 
Tube current300 µA
Detector9 Mbit Detector
Resolution8.5 – 25 µm/Pixel
3D image capture modeEvolution 4 as standard, Evolution 5 and Evolution 6 optional for unique dynamic image recordings
X-ray cabinetDesigned to meet requirements for fully protected devices in accordance with the German Radiation Protection Act (StrlSchG) and the German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h

Software

 
User interfaceViscom vVision/EasyPro 
Statistical process control Viscom vSPC/SPC, open interface (optional) 
Verification station Viscom vVerify/HARAN 
Remote diagnosis Viscom SRC (optional)
Programming station Viscom PST34 (optional)

Scope of inspection

 
InspectionAir inclusions/blow holes (voids) in surface soldering, presence, offset, excessive/insufficient solder, solder bridge, solder balls, solder sputter, soldering defects, THT fill level and pin height, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted lead, billboarding, supine, twist, wick-up effect (optional)

 

system computer

 
Operating systemWindows® 
ProcessorIntel® Core™ i9

PCB handling


iX7059 SMT Edition
Product dimensionsUp to 610 mm x 600 mm (24" x 23.6") (L x W) 
Product weightUp to 10 kg (22 lbs) 
Transfer height860 – 980 mm ± 20 mm (33.9" – 38.6" ± 0.8") 
Width adjustmentAutomatic during setup 
ClampingPneumatic 
Support area3 mm (0.1") 
Upper transport clearanceUp to 50 mm (2"), depending on resolution 
Lower transport clearanceUp to 62 mm (2.4")

Other system data


iX7059 SMT Edition
Positioning unitSynchronous linear motor 
InterfacesSMEMA, IPC Hermes (optional) 
Power requirements 400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure 
System dimensions 1493 mm x 1654 mm x 2207 mm (58.8" x 65.1" x 86.9") (W x H x D) 
Line integration dimension+30 mm (1.2") on both sides, plus side tunnel for the extended longboard option 
WeightCa. 2500 – 2700 kg (ca. 5511 – 5952 lbs) 

 

Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.

We make technology safe, reliable and sustainable

Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.

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