Camera technology | XMu-II |
| 3D sensor technology | |
| Z-resolution | 0,5 µm |
| Z-range | Bis zu 30 mm |
| Cameras | 2x 1+8 |
| Orthogonal Camera | |
| Number of megapixel cameras | 2 |
| Resolution | 13 μm |
| Field of view | 50 mm x 50 mm |
| Angled view cameras | |
| Number of megapixel cameras | 2x 8 |
| Field of view | 55 x 61 mm |
| Inspection speed | Up to 100 cm²/s (both sides) |
Double-Sided Inspection
Redefining PCB Inspection with Viscom’s iS6059 Double-Sided Inspection
Achieve fast and accurate inspection from both above and below. Designed to set a new standard in quality control, the iS6059 Double-Sided Inspection system combines innovative 3D camera technology to precisely inspect THT solder joints, press-fit, and SMD components on both sides of the PCB without shadows. This advanced system performs high-speed inspections in 2D, 2.5D, and 3D.
The iS6059 Double-Sided Inspection system is equipped with two advanced sensor heads, each mounted on separate axes, to capture images on both the top and bottom sides. The purpose: Due to the high currents involved in applications like electronic vehicles, charging infrastructure, or renewable energy, through-hole mounting remains widely used in these areas.
It is essential to not only check the top side but also the bottom side for issues such as missing pins, unsoldered pins, incomplete solder volume, or pins that are too short. Features like pin lengths can be accurately measured and documented in profiles.
In addition to its robust inspection features, the iS6059 offers adaptable lighting options to maintain consistent, high-quality image capture in any inspection environment. This adaptability ensures that manufacturers can easily customize the system for specific inspection requirements, achieving optimal defect detection rates and efficient production processes.
For more information: info@viscom.de
High-Speed Premium 3D AOI
3D inspection system iS6059 Double-Sided Inspection
- Maximum defect detection on both sides
- Flexible handling options
- Unmatched 3D camera technology
- Different illuminations
- Complete process tracking
Inspection Images from Viscom’s 3D AOI Systems
Explore a selection of inspection images captured with Viscom’s 3D AOI technology. The gallery highlights the high image quality, precise 3D visualization, and reliable detection that support quality assurance in modern industries. These examples demonstrate how advanced inspection enables accurate analysis of components and solder joints, even in challenging applications.
Technical Specifications
Software | |
| User interface | Viscom vVision/SI EasyPro |
| Statistical process control | Viscom vSPC/SPC, open interface (optional) |
| Verification station | Viscom vVerify/HARAN |
| Remote diagnosis | Viscom SRC (optional) |
| Programming station | Viscom PST34 (optional) |
Scope of inspection | |
| Components | THT, press-fit and SMD |
| Solder joints | 3D inspection of PCB bottom sides after wave soldering or selective soldering |
| Defects/defect features | SMD: Presence, XY position, rotation, component height, polarity, missing solder, soldering defects, lifted heads/tombstoning, bridging |
| THT | Presence, XY position, missing solder, soldering defects, bridging, pin height, non-wetting on pins, non-wetting on pads |
| Optional | Free area analysis, wobble circle error, color ring analysis, OCR, blow holes in the solder joint, solder ball/solder sputter |
System computer | |
| Operating system | Windows® |
| Processor | Intel®Core™i9 |
PCB handling | |
| PCB dimensions | 508 mm x 560 mm (20" x 22"); Longboard option available for circuit boards up to 720 mm (28.3") in length |
| Transport height | 850 - 950 mm ± 20 mm (33.4" - 37.4" ± 0.7"); other heights on request |
| Width adjustment | Automatic |
| Transport concept | Single-track transport system |
| PCB clamping | Pneumatic |
| Upper transport clearance | 55 mm (2.2") |
| Lower transport clearance | 55 mm (2.2") |
Other system data | |
| Positioning unit | Synchronous linear motor |
| Interfaces | SMEMA, Hermes, third-party providers |
| Power requirements | 400 V, 50 Hz, 3P/N/PE +/- 10%; 4 – 6 bar working pressure |
| System dimensions | 1100 mm x 1756 mm x 1753 mm (43.3” x 69.1” x 69”) (W x D x H) |
| Weight | Ca. 1285 kg |
Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.
We make technology safe, reliable and sustainable
Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.
