3D inspection system X7056-II
Innovative 3D X-ray inspection Viscom’s new automatic 3D inspection system, the X7056-II, is based on cutting edge X-ray technology that combines extremely rapid handling (up to 4 seconds) with unsurpassed inspection coverage, so even concealed components or solder joints and material defects can be identified. The highly innovative 3D X-ray inspection system X7056-II has been awarded five times since bringing it onto the market.
- Maximum inspection result stability
- Ultra-fast inspection times
- Maximum flexibility
- Combined AOI/AXI saves space
- Long-term investment security
Inspection Images from Viscom’s 3D AXI and 3D AOI Inspection Systems
Explore a selection of inspection images captured with Viscom’s 3D AXI and 3D AOI technology. The gallery demonstrates high-resolution imaging, reliable defect detection, and precise analysis of hidden solder joints and internal structures.
Technical Specifications
AXI Sensory | X7056-II |
| Camera technology | |
| X-ray tube | Sealed X-ray tube |
| High voltage | 60 - 130 kV |
| X-ray current | 50 - 300 µA |
| Detector | Flat panel detector (FPD), 14-bit grayscale value depth |
| Resolution | 6 - 32 µm/Pixel* |
| X-ray cabinet | Designed to meet requirements for fully protected devices in accordance with German Radiation Protection Act (StrlSchG) and German Radiation Protection Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h |
| Detector configuration | 1 FPD on xy-table, 5 fixed FPDs (additional on request) |
AOI Sensory | X7056-II |
| XM camera technology | |
| Image field size | up to 52 mm x 52 mm (2" x 2") |
| Resolution | Up to 8 µm |
| Number of megapixel cameras | Up to 9 |
| 3D AOI | |
| 3D height measurement area | Up to 30 mm (1.1") |
| Z-resolution | 0.5 µm |
| Number of megapixel cameras | 4 (8, optional) |
| XMplus camera technology (optional) |
Software | |
| User interface | Viscom vVision/EasyPro |
| Statistical process control | Viscom vSPC/SPC, open interface (optional) |
| Verification station | Viscom vVerify/HARAN |
| Remote diagnosis | Viscom SRC (Software Remote Control) (optional) |
| Programming station | Viscom PST34 (optional) |
Scope of inspection | |
| Components | BGA up to 0.3 mm pitch, QFN, DFN, LGA, THT/THR, LEDs |
| Solder joints | Visible and concealed solder joints |
| Defects/Features | Air inclusions/blow holes in solder joints (voids), presence, misalignment, excessive/insufficient solder, bridging, solder balls, solder sputter (optional), soldering defects, nonwetting, contamination, damaged component, missing or incorrect component, imperfect shape, tombstoning, lifted leads, billboarding, face down, rotation, polarity, solder wicking (optional), head-in-pillow (balls), THT filling degree and pin height |
| Combined AOI/AXI | character recognition, color recognition, barcode recognition, OCR (optional), analysis of free surfaces (optional) |
system computer | |
| Operating system | Windows® |
| Processor | Intel® Core™ i7 |
PCB handling | X7056-II | |
| PCB dimensions | Up to 450 mm x 350 mm (17.7" x 13.7") (L x W)* | |
| Transport height | 850 - 950 mm ± 20 mm (33.4" - 37.4" ± 0.7") | |
| Width adjustment | Automatic during setup | |
| PCB clamping | Pneumatic | |
| PCB support area | 3 mm (0.1") | |
| Upper transport clearance | Up to 50 mm (1.9") | |
| Lower transport clearance | 50 mm (1.9") |
Other system data | X7056-II | |
| Positioning unit | Synchronous linear motor | |
| Interfaces | SMEMA, SV70, customer specific | |
| Power requirements | 400 V (other voltages on request), 3P/N/PE, 8A, 4 - 6 bar working pressure | |
| System dimensions | 1493 mm x 1631 mm x 2251 mm (58.7" x 64.2" x 88.6") (W x H x D); width incl. xFastFlow: 1933 mm (76.1") | |
| Line integration dimension | +25 mm (0.9") | |
| Weight | 2140 kg (4717.89 lbs) |
Specifications and other system information are subject to change without notice and may differ from the information displayed at the time of ordering.
We make technology safe, reliable and sustainable
Viscom is a global leader in industrial inspection technology, delivering innovative solutions for every inspection task: From AOI, AXI, MXI, and SPI, to Bond Inspection and Conformal Coating Inspection. Powered by intelligent software and AI-driven technologies, Viscom’s award-winning systems help manufacturers worldwide achieve the highest level of quality, precision, and process reliability across industries including automotive, aerospace, semiconductor, medical technology, consumer electronics, and telecommunication.
