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Electronics production in Europe
Ensure competitiveness with intelligent inspection concepts and innovative product ideas In the medium term, only those electronics producers that meet the highest quality requirements and optimize their production processes will stay in business. To avoid defects, the causes must be identified and systematically eliminated. Linking various inspection gates creates wide-ranging possibilities for cost optimization and process reliability and permanent improvements in product quality. Constant development of inspection technology is essential. EPP Europe, 05/2017
下载高端系统:iS6059 PCB Inspection Plus
硬件加速的 3D 处理性能确保了更好的 3D 图像质量和精确的可再现性。 更大的正交景深实现了在更高的部件上进行字符识别。 智能联网的检测设备改进了机器通信。 Viscoms 创新的 3D 自动光学检测系统凭借全新的 XMplus-II 传感器技术和简易的可编程性,在高端细分市场中树立了新标杆。 摄像头模块 XMplus-II 1 个正交和 8 个斜角摄像头 分辨率:20.4 µm/Pixel +/-1% (Binning);10.2 µm/Pixel +/-1% 像场尺寸:约 50 mm x 50 mm 适用于:组装检查、部件检测、焊点检测
正面和底面:S6059 Double-Sided Inspection
创新式 iS6059 Double-Sided Inspection 双面检测:适用于印刷电路板的正面和底面的高效检测 - 其设计功能旨在利用最先进的 3D 摄像头技术实现超精准的组件、焊点和引脚检测。 上方 1 个正交摄像头和 8 个倾斜摄像头 下方 1 个正交摄像头和 8 个倾斜摄像头 分辨率:13 µm/Pixel FOV:50 x 50 mm 适用于:组装检查、部件检测、焊点检测